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Ka hoʻohana ʻana o Silicon Carbide ceramic grinding drum i ka mea hoʻomehana
Ua lilo ʻo Silicon carbide ceramic grinding barrel i mea maka o nā mea cathode no ka pā lithium ma muli o kāna waiwai conductive koʻikoʻi.ʻO ka mea hoʻomehana SiC kahi huahana koʻikoʻi o nā mea SiC a loaʻa iā ia kahi mākeke ākea ākea.
ʻO ka maikaʻi o ka pahu silika carbide wili
(1) Ka ikaika mechanical kiʻekiʻe, e like me ka maikaʻi
Hiki i ka ikaika mechanical kiʻekiʻe ke pale i ka deformation mea, he mea nui loa.ʻOi aku ka ikaika mechanical o ka Silicon carbide ma mua o ka corundum.No ka laʻana, ʻo ka ikaika compressive o ka silicon carbide he 224MPa, ʻoiai ʻo ka corundum he 75.7MPa wale nō.ʻO 15.5MPa ka ikaika kulou o ka carbide silicon, a ʻo ka corundum he 8.72MPa.
(2) Ke pale wela kiʻekiʻe, ka helu liʻiliʻi o ka hoʻonui wela
Hana ʻia ʻo Silicon carbide i nā wela kiʻekiʻe.I kekahi ʻano wela wela, pono ka mea e loaʻa i kahi ikaika kaʻina hana, a hoʻokō i ka pololei o ka hana ʻana, a hiki i ka silicon carbide ceramics ke hoʻokō i kēia mau helu ʻelua.ʻO ka mahana hoʻohana kiʻekiʻe loa o ka silicon carbide ma kahi o 800 ℃, a ʻo ka wela o ke kila he 250 ℃ wale nō.Ma ka helu ʻino ʻana, ʻo ka awelika hoʻonui wela wela o SIC he 4.4 × 10-6/C ma ka laulā o 25 ~ 1400 ℃.ʻOi aku ka liʻiliʻi o ka helu hoʻonui wela o SIC ma mua o nā mea abrasives a me nā mea wela kiʻekiʻe.No ka laʻana, hiki ke kiʻekiʻe ka coefficient o ka hoʻonui wela o ka corundum e like me (7 ~ 8) × 10-6 / ℃.
(3) Ke kū'ē i ka corrosion
Silicon carbide ma muli o kona helu heheʻe (decomposition wela), kemika inertia a me ka thermal shock resistance he kiʻekiʻe, hiki ke hoʻohana ʻia no nā ʻano huahana silicon carbide ceramic, e like me nā huahana ceramic wili ʻana i nā mea hana, ka pā kaupaku a me ka sagger, zinc smelting industrial vertical ka umu hoʻoheheʻe cylinder me ka pōhaku silika carbide, alumini electrolytic cell lining, crucible, mea umu liʻiliʻi.
Ke noi pale ʻana i ka corrosion
1, Nā ʻāpana sliding (seal mechanical, pump chemical bearing, shaft)
2, nā mea hana Crusher (classifier, air mill, sand mill)
3. Semiconductor mea hana 'āpana (XY platform, MOCVD pā, kālele apo, wafer chuck)
4. Nā ʻāpana o ka mīkini hoʻoheheʻe ʻia (nā ʻāpana o ka mīkini hoʻoheheʻe lens kamera)
5. Nā ʻāpana pale wela (nozzle puhi, nā ʻāpana mīkini hoʻāʻo wela kiʻekiʻe, metala hoʻoheheʻe ʻia)
6. Nā ʻāpana pale ʻaʻahu (nozzle mīkini hoʻoheheʻe ʻana i ke one, ka mīkini hoʻoheheʻe ʻana i ka pahi pahu mīkini hoʻomaloʻo, ka pā pale paipu i kanu ʻia, ke apo alakaʻi lawaiʻa)
Lawelawe
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inā he nīnau ʻē aʻe kāu, pls e ʻoluʻolu e hoʻokaʻaʻike mai iā mākou e like me lalo.
No ke aha ʻoe e koho ai iā Wei Tai?
1) loaʻa iā mākou ka hōʻoiaʻiʻo waiwai.
2) hōʻoia ʻia ka paʻa ʻoihana i ka pono o ka huahana.E hāʻawi maikaʻi ʻia ka huahana iā ʻoe.
3) ʻoi aku ka nui o nā ala logistic e hiki ai i nā huahana ke hāʻawi iā ʻoe.