Hoʻolauna ʻo Semicera i kaWafer Cassette Carrier, he hopena koʻikoʻi no ka mālama pono ʻana i nā wafers semiconductor. Hoʻolālā ʻia kēia mea lawe ukana e hoʻokō i nā koi koʻikoʻi o ka ʻoihana semiconductor, e hōʻoiaʻiʻo ana i ka pale a me ka pololei o kāu mau wafers i loko o ke kaʻina hana.
Nā mea nui:
•ʻO ke kūkulu paʻa:ʻO kaWafer Cassette Carrierua kūkulu ʻia mai nā mea kiʻekiʻe a me nā mea paʻa e kū i ka paʻakikī o nā kaiapuni semiconductor, e hāʻawi ana i ka pale hilinaʻi mai ka ʻinoʻino a me ka pōʻino kino.
•Hoʻopololei pololei:Hoʻolālā ʻia no ka hoʻonohonoho pono ʻana o ka wafer, hōʻoia kēia mea lawe i ka paʻa ʻana o nā wafers ma kahi, e hōʻemi ana i ka pilikia o ka misalignment a i ʻole ka pōʻino i ka wā o ka lawe ʻana.
•Hoʻohana maʻalahi:Hoʻolālā ʻia ergonomically no ka maʻalahi o ka hoʻohana ʻana, hoʻomaʻamaʻa ka mea lawe i ka hoʻouka ʻana a me ka wehe ʻana i ke kaʻina hana, hoʻomaikaʻi i ka hana holoʻokoʻa i nā wahi lumi maʻemaʻe.
•Hoʻohālikelike:Hoʻohālikelike me ka nui o nā ʻano wafer a me nā ʻano, e hoʻolilo iā ia i mea maʻalahi no nā pono hana semiconductor.
E ʻike i ka pale like ʻole a me ka maʻalahi me Semicera'sWafer Cassette Carrier. Hoʻolālā ʻia kā mākou mea lawe e hoʻokō i nā kūlana kiʻekiʻe loa o ka hana semiconductor, e hōʻoiaʻiʻo ana i kāu mau wafers e noho maʻemaʻe mai ka hoʻomaka a hiki i ka pau. E hilinaʻi iā Semicera e hāʻawi i ka maikaʻi a me ka hilinaʻi āu e pono ai no kāu kaʻina hana koʻikoʻi.
| Nā mea | Paahana | Ka noiʻi | Dummy |
| Nā Kūlana Crystal | |||
| Polytype | 4H | ||
| Ua hewa ka hoʻonohonoho ʻana o ka ʻili | <11-20 >4±0.15° | ||
| Nā Kūlana Uila | |||
| Dopant | n-ʻano Nitrogen | ||
| Kū'ē | 0.015-0.025ohm·cm | ||
| Nā Kūlana Mechanical | |||
| Anawaena | 150.0±0.2mm | ||
| mānoanoa | 350±25 μm | ||
| Kūlana pālahalaha mua | [1-100]±5° | ||
| Ka lōʻihi pālahalaha mua | 47.5±1.5mm | ||
| palahalaha lua | ʻAʻohe | ||
| TTV | ≤5 μm | ≤10 μm | ≤15 μm |
| LTV | ≤3 μm(5mm*5mm) | ≤5 μm(5mm*5mm) | ≤10 μm(5mm*5mm) |
| Kakaka | -15μm ~ 15μm | -35μm ~ 35μm | -45μm ~ 45μm |
| Warp | ≤35 μm | ≤45 μm | ≤55 μm |
| 'Oka (AFM) mua (Si-maka) | Ra≤0.2nm (5μm*5μm) | ||
| Hoʻolālā | |||
| Micropipe mānoanoa | <1 ea/cm2 | <10 ea/cm2 | <15 ea/cm2 |
| Metala haumia | ≤5E10atoms/cm2 | NA | |
| BPD | ≤1500 ea/cm2 | ≤3000 ea/cm2 | NA |
| TSD | ≤500 ea/cm2 | ≤1000 ea/cm2 | NA |
| ʻAno o mua | |||
| Imua | Si | ||
| Hoʻopau ʻili | Si-maka CMP | ||
| Nā ʻāpana | ≤60ea/wafer (nui≥0.3μm) | NA | |
| Nā ʻōpala | ≤5ea/mm. Ka lōʻihi huila ≤Diameter | ʻO ka lōʻihi huila≤2*Diameter | NA |
| ʻAlani ʻili/mau lua/ʻeleʻele/striations/ māwae/contamination | ʻAʻohe | NA | |
| Nā ʻāpana lihi/indents/fracture/papa hex | ʻAʻohe | ||
| Nā wahi polytype | ʻAʻohe | ʻĀpana huila≤20% | ʻĀpana huila≤30% |
| Hōʻailona laser mua | ʻAʻohe | ||
| ʻAno o hope | |||
| Hoʻopau hope | C-maka CMP | ||
| Nā ʻōpala | ≤5ea / mm, Ka lōʻihi huila≤2 * Anawaena | NA | |
| Nā hemahema o hope (nā ʻāpana lihi/indents) | ʻAʻohe | ||
| ʻōkalakala kua | Ra≤0.2nm (5μm*5μm) | ||
| Hōʻailona laser hope | 1 mm (mai ka lihi luna) | ||
| Kaulana | |||
| Kaulana | Chamfer | ||
| Hoʻopili ʻia | |||
| Hoʻopili ʻia | Epi-mākaukau me ka hoʻopaʻa ʻumeke Puke cassette nui-wafer | ||
| *Nā memo: "NA" ʻo ia hoʻi, ʻaʻohe noi ʻO nā mea i ʻōlelo ʻole ʻia e pili ana i SEMI-STD. | |||




