ʻO Semicera's 2~6 inch 4° off-angle P-type 4H-SiC substrates ua hana ʻia e hoʻokō i nā pono ulu o ka mana hana kiʻekiʻe a me nā mea hana RF. ʻO ka 4° off-angle orientation e hōʻoia i ka ulu ʻana o ka epitaxial, e hana ana i kēia substrate i kumu kūpono no ka nui o nā mea semiconductor, me nā MOSFET, IGBT, a me nā diodes.
ʻO kēia 2 ~ 6 iniha 4 ° off-angle P-type 4H-SiC substrate he waiwai waiwai maikaʻi loa, me ka conductivity thermal kiʻekiʻe, ka hana uila maikaʻi loa, a me ke kūpaʻa mechanical. ʻO ka ʻaoʻao o waho e kōkua i ka hōʻemi ʻana i ka micropipe density a hoʻolalelale i nā papa epitaxial, he mea koʻikoʻi ia i ka hoʻomaikaʻi ʻana i ka hana a me ka hilinaʻi o ka mīkini semiconductor hope loa.
ʻO Semicera's 2~6 inch 4° off-angle P-type 4H-SiC substrates i loaʻa i nā anawaena like ʻole, mai ka 2 iniha a 6 iniha, no ka hoʻokō ʻana i nā koi hana ʻokoʻa. Hoʻonohonoho pololei ʻia kā mākou substrates e hāʻawi i nā pae doping like ʻole a me nā hiʻohiʻona kiʻekiʻe kiʻekiʻe, e hōʻoia ana i kēlā me kēia wafer e hoʻokō i nā kikoʻī koʻikoʻi i koi ʻia no nā noi uila holomua.
ʻO ka hoʻokō ʻana o Semicera i ka hana hou a me ka maikaʻi e hōʻoia i kā mākou 2~6 iniha 4 ° off-angle P-type 4H-SiC substrates e hāʻawi i ka hana maʻamau i kahi ākea o nā noi mai ka uila uila a hiki i nā hāmeʻa kiʻekiʻe. Hāʻawi kēia huahana i kahi hopena hilinaʻi no ka hanauna e hiki mai ana o ka ikehu, hana kiʻekiʻe semiconductors, kākoʻo i ka holomua ʻenehana i nā ʻoihana e like me ka automotive, telecommunications, a me ka ikehu hou.
Nā kūlana pili i ka nui
Nui | 2-Iniha | 4-Iniha |
Anawaena | 50.8 mm±0.38 mm | 100.0 mm+0/-0.5 mm |
Orentation i luna | 4° i ka<11-20>±0.5° | 4° i ka<11-20>±0.5° |
Ka lōʻihi pālahalaha | 16.0 mm±1.5mm | 32.5mm±2mm |
Ka lōʻihi pālahalaha lua | 8.0 mm±1.5mm | 18.0 mm ± 2 mm |
Kūlana Pāha mua | E like me <11-20>±5.0° | Kaulike <11-20>±5.0c |
Kūlana Pāpā lua | 90°CW mai ka mua ± 5.0°, ke alo i luna o ke silika | 90°CW mai ka mua ± 5.0°, ke alo i luna o ke silika |
Hoʻopau ʻili | C-Face: Optical Polish, Si-Face: CMP | C-Face: OpticalPolish, Si-Face: CMP |
Wafer Edge | ʻO ka beveling | ʻO ka beveling |
ʻAole ʻili | Si-Face Ra<0.2 nm | Si-Face Ra<0.2nm |
mānoanoa | 350.0±25.0um | 350.0±25.0um |
Polytype | 4H | 4H |
Doping | p-Ano | p-Ano |
Nā kūlana pili i ka nui
Nui | 6-Iniha |
Anawaena | 150.0 mm+0/-0.2 mm |
Kūlana ʻili | 4° i ka<11-20>±0.5° |
Ka lōʻihi pālahalaha | 47.5 mm ± 1.5mm |
Ka lōʻihi pālahalaha lua | ʻAʻohe |
Kūlana Pāha mua | Kaulike me <11-20>±5.0° |
ʻŌnaehana Paʻa lua | 90°CW mai ka mua ± 5.0°, ke alo kilika i luna |
Hoʻopau ʻili | C-Face: Optical Polish, Si-Face:CMP |
Wafer Edge | ʻO ka beveling |
ʻAole ʻili | Si-Face Ra<0.2 nm |
mānoanoa | 350.0±25.0μm |
Polytype | 4H |
Doping | p-Ano |