2~6 iniha 4° o waho-koki P-type 4H-SiC substrate

ʻO ka wehewehe pōkole:

ʻO 4° off-angle P-type 4H-SiC substrate he mea semiconductor kiko'ī, kahi o "4° off-angle" e pili ana i ka huina aniani o ka wafer he 4 degere ma waho o ke kihi, a ʻo ka "P-type" e pili ana i ke ʻano conductivity o ka semiconductor. He mau noi koʻikoʻi kēia mea i loko o ka ʻoihana semiconductor, ʻoi aku hoʻi ma nā kahua o ka uila uila a me nā uila uila kiʻekiʻe.


Huahana Huahana

Huahana Huahana

ʻO Semicera's 2~6 inch 4° off-angle P-type 4H-SiC substrates ua hana ʻia e hoʻokō i nā pono ulu o ka mana hana kiʻekiʻe a me nā mea hana RF. ʻO ka 4° off-angle orientation e hōʻoia i ka ulu ʻana o ka epitaxial, e hana ana i kēia substrate i kumu kūpono no ka nui o nā mea semiconductor, me nā MOSFET, IGBT, a me nā diodes.

ʻO kēia 2 ~ 6 iniha 4 ° off-angle P-type 4H-SiC substrate he waiwai waiwai maikaʻi loa, me ka conductivity thermal kiʻekiʻe, ka hana uila maikaʻi loa, a me ke kūpaʻa mechanical. ʻO ka ʻaoʻao o waho e kōkua i ka hōʻemi ʻana i ka micropipe density a hoʻolalelale i nā papa epitaxial, he mea koʻikoʻi ia i ka hoʻomaikaʻi ʻana i ka hana a me ka hilinaʻi o ka mīkini semiconductor hope loa.

ʻO Semicera's 2~6 inch 4° off-angle P-type 4H-SiC substrates i loaʻa i nā anawaena like ʻole, mai ka 2 iniha a 6 iniha, no ka hoʻokō ʻana i nā koi hana ʻokoʻa. Hoʻonohonoho pololei ʻia kā mākou substrates e hāʻawi i nā pae doping like ʻole a me nā hiʻohiʻona kiʻekiʻe kiʻekiʻe, e hōʻoia ana i kēlā me kēia wafer e hoʻokō i nā kikoʻī koʻikoʻi i koi ʻia no nā noi uila holomua.

ʻO ka hoʻokō ʻana o Semicera i ka hana hou a me ka maikaʻi e hōʻoia i kā mākou 2~6 iniha 4 ° off-angle P-type 4H-SiC substrates e hāʻawi i ka hana maʻamau i kahi ākea o nā noi mai ka uila uila a hiki i nā hāmeʻa kiʻekiʻe. Hāʻawi kēia huahana i kahi hopena hilinaʻi no ka hanauna e hiki mai ana o ka ikehu, hana kiʻekiʻe semiconductors, kākoʻo i ka holomua ʻenehana i nā ʻoihana e like me ka automotive, telecommunications, a me ka ikehu hou.

Nā kūlana pili i ka nui

Nui 2 iniha 4 iniha
Anawaena 50.8 mm±0.38 mm 100.0 mm+0/-0.5 mm
Orentation i luna 4° i ka<11-20>±0.5° 4° i ka<11-20>±0.5°
Ka lōʻihi pālahalaha 16.0 mm±1.5mm 32.5mm±2mm
Ka lōʻihi pālahalaha lua 8.0 mm±1.5mm 18.0 mm ± 2 mm
Kūlana Pāha mua E like me <11-20>±5.0° Kaulike <11-20>±5.0c
Kūlana Papalua 90°CW mai ka mua ± 5.0°, ke alo i luna o ke silika 90°CW mai ka mua ± 5.0°, ke alo i luna o ke silika
Hoʻopau ʻili C-Face: Optical Polish, Si-Face: CMP C-Face: OpticalPolish, Si-Face: CMP
Wafer Edge ʻO ka beveling ʻO ka beveling
ʻAole ʻili Si-Face Ra<0.2 nm Si-Face Ra<0.2nm
mānoanoa 350.0±25.0um 350.0±25.0um
Polytype 4H 4H
Doping p-Ano p-Ano

Nā kūlana pili i ka nui

Nui 6 iniha
Anawaena 150.0 mm+0/-0.2 mm
Kūlana ʻili 4° i ka<11-20>±0.5°
Ka lōʻihi pālahalaha 47.5 mm ± 1.5mm
Ka lōʻihi pālahalaha lua ʻAʻohe
Kūlana Pāha mua Kaulike me <11-20>±5.0°
ʻŌnaehana Paʻa lua 90°CW mai ka mua ± 5.0°, ke alo kilika i luna
Hoʻopau ʻili C-Face: Optical Polish, Si-Face:CMP
Wafer Edge ʻO ka beveling
ʻAole ʻili Si-Face Ra<0.2 nm
mānoanoa 350.0±25.0μm
Polytype 4H
Doping p-Ano

Ramana

2-6 iniha 4° o waho-koki P-type 4H-SiC substrate-3

ʻĀpana pōhaku

2-6 iniha 4° o waho-koki P-type 4H-SiC substrate-4

Dislocation density (KOH etching)

2-6 iniha 4° o waho-koki P-type 4H-SiC substrate-5

Nā kiʻi kālai ʻia KOH

2-6 iniha 4° o waho-koki P-type 4H-SiC substrate-6
SiC wafers

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