4″ 6″ 8″ Mea hoʻokele a me Semi-insulating Substrates

ʻO ka wehewehe pōkole:

Ua kūpaʻa ʻo Semicera i ka hoʻolako ʻana i nā substrates semiconductor kiʻekiʻe, ʻo ia nā mea koʻikoʻi no ka hana ʻana i nā mea hana semiconductor. Hoʻokaʻawale ʻia kā mākou substrates i nā ʻano conductive a semi-insulating e hoʻokō i nā pono o nā noi like ʻole. Ma ka hoʻomaopopo hohonu ʻana i nā waiwai uila o nā substrates, kōkua ʻo Semicera iā ʻoe e koho i nā mea kūpono loa e hōʻoia i ka hana maikaʻi loa i ka hana ʻana i nā mea hana. E koho iā Semicera, e koho i ka maikaʻi maikaʻi loa e hoʻoikaika ana i ka hilinaʻi a me ka hana hou.


Huahana Huahana

Huahana Huahana

ʻO Silicon carbide (SiC) hoʻokahi kristal mea i loaʻa i kahi ākea ākea nui (~ Si 3 mau manawa), kiʻekiʻe thermal conductivity (~ Si 3.3 mau manawa a i ʻole GaAs 10 manawa), kiʻekiʻe electron saturation migration rate (~ Si 2.5 mau manawa), kiʻekiʻe breakdown uila. kahua (~ Si 10 manawa a i ʻole GaAs 5 manawa) a me nā hiʻohiʻona ʻē aʻe.

ʻO ke kolu o ka hanauna semiconductor waiwai ka nui o ka SiC, GaN, daimana, a me nā mea ʻē aʻe, no ka mea, ʻoi aku ka nui o kona ākea ākea (Eg) ma mua a i ʻole like me 2.3 electron volts (eV), ʻike ʻia hoʻi he mau mea semiconductor ākea band gap. Ke hoʻohālikelike ʻia me nā mea semiconductor o ka hanauna mua a me ka lua, ʻo ke kolu o ka hanauna semiconductor nā mea maikaʻi o ke kiʻekiʻe thermal conductivity, kiʻekiʻe breakdown uila kahua, kiʻekiʻe saturated electron migration rate a me ka ikaika hoʻopaʻa kiʻekiʻe, hiki ke hoʻokō i nā koi hou o ka ʻenehana uila hou no ke kiʻekiʻe. ka mahana, ka mana kiʻekiʻe, ke kaomi kiʻekiʻe, ke alapine kiʻekiʻe a me ka pale ʻana i ka radiation a me nā kūlana koʻikoʻi ʻē aʻe. Loaʻa iā ia nā manaʻo noiʻi koʻikoʻi ma nā kahua o ka pale aupuni, ka mokulele, ka aerospace, ka ʻimi ʻaila, ka mālama ʻana i ka optical, a me nā mea ʻē aʻe, a hiki ke hōʻemi i ka nalowale o ka ikehu ma mua o 50% i nā ʻoihana hoʻolālā he nui e like me ke kamaʻilio broadband, ikehu lā, hana kaʻa, ʻO nā kukui semiconductor, a me ka mākaʻikaʻi akamai, a hiki ke hōʻemi i ka nui o nā mea hana ma mua o 75%, he mea nui ia no ka hoʻomohala ʻana i ka ʻepekema kanaka a me ka ʻenehana.

Hiki i ka ikaika Semicera ke hāʻawi aku i nā mea kūʻai aku me ke kūlana kiʻekiʻe Conductive (Conductive), Semi-insulating (Semi-insulating), HPSI (High Purity semi-insulating) silicon carbide substrate; Eia hou, hiki iā mākou ke hāʻawi aku i nā mea kūʻai aku me nā pepa epitaxial silicon carbide homogeneous a heterogeneous; Hiki iā mākou ke hoʻopilikino i ka pepa epitaxial e like me nā pono kikoʻī o nā mea kūʻai aku, a ʻaʻohe palena liʻiliʻi.

OLELO HOOLAHA WAFERING

*n-Pm=n-type Pm-Grade,n-Ps=n-type Ps-Grade,Sl=Semi-lnsulating

'ikamu

8-Inika

6-Iniha

4-Iniha
nP n-Pm n-Ps SI SI
TTV(GBIR) ≤6um ≤6um
Kakaka (GF3YFCD)-Waiwai Loa ≤15μm ≤15μm ≤25μm ≤15μm
Warp(GF3YFER) ≤25μm ≤25μm ≤40μm ≤25μm
LTV(SBIR)-10mmx10mm <2μm
Wafer Edge ʻO ka beveling

ILI HOPE

*n-Pm=n-type Pm-Grade,n-Ps=n-type Ps-Grade,Sl=Semi-Insulating

'ikamu

8-Inika

6-Iniha

4-Iniha

nP n-Pm n-Ps SI SI
Hoʻopau ʻili ʻaoʻao ʻelua Optical Polish, Si- Face CMP
ʻAhaʻulaʻula (10um x 10um) Si-FaceRa≤0.2nm
C-Face Ra≤ 0.5nm
(5umx5um) Si-Face Ra≤0.2nm
C-Face Ra≤0.5nm
ʻOpeʻa lihi ʻAʻohe ʻae ʻia (lōʻihi a laula≥0.5mm)
Indents ʻAʻole ʻae ʻia
Nā ʻōpala (Si-Face) Ka nui.≤5, Huihui
Length≤0.5×wafer anawaena
Ka nui.≤5, Huihui
Length≤0.5×wafer anawaena
Ka nui.≤5, Huihui
Length≤0.5×wafer anawaena
māwae ʻAʻole ʻae ʻia
Hoʻokuʻu Edge 3mm
第2页-2
第2页-1
SiC wafers

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