Ke kū nei ʻo Semicera's 6 Inch N-type SiC Wafer ma ke alo o ka ʻenehana semiconductor. Hana ʻia no ka hana maikaʻi loa, ʻoi aku kēia wafer i ka mana kiʻekiʻe, kiʻekiʻe-frequency, a me nā noi wela kiʻekiʻe, pono no nā mea uila kiʻekiʻe.
ʻO kā mākou 6 Inch N-type SiC wafer e hōʻike ana i ka mobility electron kiʻekiʻe a me ka haʻahaʻa haʻahaʻa, ʻo ia nā ʻāpana koʻikoʻi no nā mea mana e like me MOSFET, diodes, a me nā mea ʻē aʻe. Hōʻoia kēia mau waiwai i ka hoʻololi ʻana i ka ikehu maikaʻi a me ka hoʻemi ʻana i ka wela, hoʻonui i ka hana a me ke ola o nā ʻōnaehana uila.
ʻO nā kaʻina hoʻomalu maikaʻi koʻikoʻi o Semicera e hōʻoia i ka mālama ʻana o kēlā me kēia wafer SiC i ka palahalaha maikaʻi loa a me nā hemahema liʻiliʻi. ʻO kēia nānā pono i nā kikoʻī e hōʻoia i ka hoʻokō ʻana o kā mākou wafers i nā koi koʻikoʻi o nā ʻoihana e like me ka automotive, aerospace, a me ke kelepona.
Ma waho aʻe o kāna mau waiwai uila maikaʻi loa, hāʻawi ka N-type SiC wafer i ka paʻa wela a me ke kūpaʻa ʻana i nā wela kiʻekiʻe, e kūpono ana ia no nā kaiapuni kahi e hāʻule ai nā mea maʻamau. He waiwai nui kēia mana i nā noi e pili ana i nā hana kiʻekiʻe a me ka mana kiʻekiʻe.
Ma ke koho ʻana iā Semicera's 6 Inch N-type SiC Wafer, ke hoʻopukapuka nei ʻoe i kahi huahana e hōʻike ana i ka piko o ka hana hou semiconductor. Hoʻopaʻa mākou i ka hāʻawi ʻana i nā poloka hale no nā mea ʻokiʻoki, e hōʻoia i ka loaʻa ʻana o kā mākou mau hoa ma nā ʻoihana like ʻole i nā mea maikaʻi loa no kā lākou holomua ʻenehana.
| Nā mea | Paahana | Ka noiʻi | Dummy |
| Nā Kūlana Crystal | |||
| Polytype | 4H | ||
| Ua hewa ka hoʻonohonoho ʻana o ka ʻili | <11-20 >4±0.15° | ||
| Nā Kūlana Uila | |||
| Dopant | n-ʻano Nitrogen | ||
| Kū'ē | 0.015-0.025ohm·cm | ||
| Nā Kūlana Mechanical | |||
| Anawaena | 150.0±0.2mm | ||
| mānoanoa | 350±25 μm | ||
| Kūlana pālahalaha mua | [1-100]±5° | ||
| Ka lōʻihi pālahalaha mua | 47.5±1.5mm | ||
| palahalaha lua | ʻAʻohe | ||
| TTV | ≤5 μm | ≤10 μm | ≤15 μm |
| LTV | ≤3 μm(5mm*5mm) | ≤5 μm(5mm*5mm) | ≤10 μm(5mm*5mm) |
| Kakaka | -15μm ~ 15μm | -35μm ~ 35μm | -45μm ~ 45μm |
| Warp | ≤35 μm | ≤45 μm | ≤55 μm |
| 'Oka (AFM) mua (Si-maka) | Ra≤0.2nm (5μm*5μm) | ||
| Hoʻolālā | |||
| Micropipe mānoanoa | <1 ea/cm2 | <10 ea/cm2 | <15 ea/cm2 |
| Metala haumia | ≤5E10atoms/cm2 | NA | |
| BPD | ≤1500 ea/cm2 | ≤3000 ea/cm2 | NA |
| TSD | ≤500 ea/cm2 | ≤1000 ea/cm2 | NA |
| ʻAno o mua | |||
| Imua | Si | ||
| Hoʻopau ʻili | Si-maka CMP | ||
| Nā ʻāpana | ≤60ea/wafer (nui≥0.3μm) | NA | |
| Nā ʻōpala | ≤5ea/mm. Ka lōʻihi huila ≤Diameter | ʻO ka lōʻihi huila≤2*Diameter | NA |
| ʻAlani ʻili/mau lua/ʻeleʻele/striations/ māwae/contamination | ʻAʻohe | NA | |
| Nā ʻāpana lihi/indents/fracture/papa hex | ʻAʻohe | ||
| Nā wahi polytype | ʻAʻohe | ʻĀpana huila≤20% | ʻĀpana huila≤30% |
| Hōʻailona laser mua | ʻAʻohe | ||
| ʻAno o hope | |||
| Hoʻopau hope | C-maka CMP | ||
| Nā ʻōpala | ≤5ea / mm, Ka lōʻihi huila≤2 * Anawaena | NA | |
| Nā pōʻino hope (nā ʻāpana lihi/indents) | ʻAʻohe | ||
| ʻōkalakala kua | Ra≤0.2nm (5μm*5μm) | ||
| Hōʻailona laser hope | 1 mm (mai ka lihi luna) | ||
| Kaulana | |||
| Kaulana | Chamfer | ||
| Hoʻopili ʻia | |||
| Hoʻopili ʻia | Epi-mākaukau me ka hoʻopaʻa ʻumeke Puke cassette nui-wafer | ||
| *Nā memo: "NA" ʻo ia hoʻi, ʻaʻohe noi ʻO nā mea i ʻōlelo ʻole ʻia e pili ana i SEMI-STD. | |||
