Hoʻolālā ʻia nā Wafers SiC 6 Semi-Insulating HPSI SiC o Semicera e hoʻokō i nā koi ikaika o ka ʻenehana semiconductor hou. Me ka maʻemaʻe maikaʻi a me ka paʻa, lilo kēia mau wafers i kumu hilinaʻi no ka hoʻomohala ʻana i nā ʻāpana uila kiʻekiʻe.
ʻIke ʻia kēia mau wafers HPSI SiC no kā lākou conductivity thermal koʻikoʻi a me ka insulation uila, he mea koʻikoʻi ia no ka hoʻomaikaʻi ʻana i ka hana o nā mana mana a me nā kaapuni kiʻekiʻe. Kōkua nā waiwai semi-insulating i ka hōʻemi ʻana i ka hoʻopili uila a me ka hoʻonui ʻana i ka pono o ka mīkini.
ʻO ke kaʻina hana hana kiʻekiʻe i hoʻohana ʻia e Semicera e hōʻoia i kēlā me kēia wafer i ka mānoanoa like ʻole a me nā hemahema liʻiliʻi. Pono kēia kikoʻī no nā noi kiʻekiʻe e like me nā mea uila uila, nā mea hoʻohuli mana, a me nā ʻōnaehana LED, kahi o ka hana a me ka lōʻihi ke kumu nui.
Ma ka hoʻohana ʻana i nā ʻenehana hana kiʻekiʻe, hāʻawi ʻo Semicera i nā wafers ʻaʻole i kūpono wale akā ʻoi aku i nā kūlana ʻoihana. Hāʻawi ka nui 6-inch i ka maʻalahi i ka hoʻonui ʻana i ka hana, e mālama ana i nā noiʻi noiʻi a me nā noi kalepa ma ka māhele semiconductor.
ʻO ke koho ʻana i nā Wafers SiC 6 ʻīniha Semicera Semi-Insulating HPSI ʻo ia hoʻi ka hoʻokomo ʻana i kahi huahana e hāʻawi i ka maikaʻi a me ka hana. He ʻāpana kēia o nā wafers o Semicera i ka hoʻoikaika ʻana i ka hiki o ka ʻenehana semiconductor ma o nā mea hana hou a me ka hana akamai.
| Nā mea | Paahana | Ka noiʻi | Dummy |
| Nā Kūlana Crystal | |||
| Polytype | 4H | ||
| Ua hewa ka hoʻonohonoho ʻana o ka ʻili | <11-20 >4±0.15° | ||
| Nā Kūlana Uila | |||
| Dopant | n-ʻano Nitrogen | ||
| Kū'ē | 0.015-0.025ohm·cm | ||
| Nā Kūlana Mechanical | |||
| Anawaena | 150.0±0.2mm | ||
| mānoanoa | 350±25 μm | ||
| Kūlana pālahalaha mua | [1-100]±5° | ||
| Ka lōʻihi pālahalaha mua | 47.5±1.5mm | ||
| palahalaha lua | ʻAʻohe | ||
| TTV | ≤5 μm | ≤10 μm | ≤15 μm |
| LTV | ≤3 μm(5mm*5mm) | ≤5 μm(5mm*5mm) | ≤10 μm(5mm*5mm) |
| Kakaka | -15μm ~ 15μm | -35μm ~ 35μm | -45μm ~ 45μm |
| Warp | ≤35 μm | ≤45 μm | ≤55 μm |
| 'Oka (AFM) mua (Si-maka) | Ra≤0.2nm (5μm*5μm) | ||
| Hoʻolālā | |||
| Micropipe mānoanoa | <1 ea/cm2 | <10 ea/cm2 | <15 ea/cm2 |
| Metala haumia | ≤5E10atoms/cm2 | NA | |
| BPD | ≤1500 ea/cm2 | ≤3000 ea/cm2 | NA |
| TSD | ≤500 ea/cm2 | ≤1000 ea/cm2 | NA |
| ʻAno o mua | |||
| Imua | Si | ||
| Hoʻopau ʻili | Si-maka CMP | ||
| Nā ʻāpana | ≤60ea/wafer (nui≥0.3μm) | NA | |
| Nā ʻōpala | ≤5ea/mm. Ka lōʻihi huila ≤Diameter | ʻO ka lōʻihi huila≤2*Diameter | NA |
| ʻAlani ʻili/mau lua/ʻeleʻele/striations/ māwae/contamination | ʻAʻohe | NA | |
| Nā ʻāpana lihi/indents/fracture/papa hex | ʻAʻohe | ||
| Nā wahi polytype | ʻAʻohe | ʻĀpana huila≤20% | ʻĀpana huila≤30% |
| Hōʻailona laser mua | ʻAʻohe | ||
| ʻAno o hope | |||
| Hoʻopau hope | C-maka CMP | ||
| Nā ʻōpala | ≤5ea / mm, Ka lōʻihi huila≤2 * Anawaena | NA | |
| Nā pōʻino hope (nā ʻāpana lihi/indents) | ʻAʻohe | ||
| ʻōkalakala kua | Ra≤0.2nm (5μm*5μm) | ||
| Hōʻailona laser hope | 1 mm (mai ka lihi luna) | ||
| Kaulana | |||
| Kaulana | Chamfer | ||
| Hoʻopili ʻia | |||
| Hoʻopili ʻia | Epi-mākaukau me ka hoʻopaʻa ʻumeke Puke cassette nui-wafer | ||
| *Nā memo: "NA" ʻo ia hoʻi, ʻaʻohe noi ʻO nā mea i ʻōlelo ʻole ʻia e pili ana i SEMI-STD. | |||
