6 ʻīniha n-type sic substrate

ʻO ka wehewehe pōkole:

ʻO 6-ʻīniha n-type SiC substrate‌ he mea semiconductor i hōʻike ʻia e ka hoʻohana ʻana i ka nui wafer 6-ʻīniha, e hoʻonui ai i ka nui o nā mea hana i hiki ke hana ʻia ma kahi wafer hoʻokahi ma luna o kahi ʻāpana nui, a laila e hōʻemi ana i nā kumukūʻai pae kiʻekiʻe. . ʻO ka hoʻomohala ʻana a me ka hoʻohana ʻana i nā substrates 6-n-type SiC i pōmaikaʻi mai ka holomua ʻana o nā ʻenehana e like me ke ʻano o ka ulu ʻana o RAF, e hōʻemi ana i nā dislocations ma o ka ʻoki ʻana i nā kristal ma nā dislocations a me nā kuhikuhi like a me ka ulu hou ʻana i nā kristal, a laila e hoʻomaikaʻi ai i ka maikaʻi o ka substrate. He mea koʻikoʻi ka hoʻohana ʻana o kēia substrate i ka hoʻomaikaʻi ʻana i ka hana hana a me ka hōʻemi ʻana i nā kumukūʻai o nā mana mana SiC.

 


Huahana Huahana

Huahana Huahana

ʻO Silicon carbide (SiC) hoʻokahi kristal mea i loaʻa i kahi ākea ākea nui (~ Si 3 mau manawa), kiʻekiʻe thermal conductivity (~ Si 3.3 mau manawa a i ʻole GaAs 10 manawa), kiʻekiʻe electron saturation migration rate (~ Si 2.5 mau manawa), kiʻekiʻe breakdown uila. kahua (~ Si 10 manawa a i ʻole GaAs 5 manawa) a me nā hiʻohiʻona ʻē aʻe.

ʻO ke kolu o ka hanauna semiconductor waiwai ka nui o ka SiC, GaN, daimana, a me nā mea ʻē aʻe, no ka mea, ʻoi aku ka nui o kona ākea ākea (Eg) ma mua a i ʻole like me 2.3 electron volts (eV), ʻike ʻia hoʻi he mau mea semiconductor ākea band gap. Ke hoʻohālikelike ʻia me nā mea semiconductor o ka hanauna mua a me ka lua, ʻo ke kolu o ka hanauna semiconductor nā mea maikaʻi o ke kiʻekiʻe thermal conductivity, kiʻekiʻe breakdown uila kahua, kiʻekiʻe saturated electron migration rate a me ka ikaika hoʻopaʻa kiʻekiʻe, hiki ke hoʻokō i nā koi hou o ka ʻenehana uila hou no ke kiʻekiʻe. ka mahana, ka mana kiʻekiʻe, ke kaomi kiʻekiʻe, ke alapine kiʻekiʻe a me ka pale ʻana i ka radiation a me nā kūlana koʻikoʻi ʻē aʻe. Loaʻa iā ia nā manaʻo noiʻi koʻikoʻi ma nā kahua o ka pale aupuni, ka mokulele, ka aerospace, ka ʻimi ʻaila, ka mālama ʻana i ka optical, a me nā mea ʻē aʻe, a hiki ke hōʻemi i ka nalowale o ka ikehu ma mua o 50% i nā ʻoihana hoʻolālā he nui e like me ke kamaʻilio broadband, ikehu lā, hana kaʻa, ʻO nā kukui semiconductor, a me ka mākaʻikaʻi akamai, a hiki ke hōʻemi i ka nui o nā mea hana ma mua o 75%, he mea nui ia no ka hoʻomohala ʻana i ka ʻepekema kanaka a me ka ʻenehana.

Hiki i ka ikaika Semicera ke hāʻawi aku i nā mea kūʻai aku me ke kūlana kiʻekiʻe Conductive (Conductive), Semi-insulating (Semi-insulating), HPSI (High Purity semi-insulating) silicon carbide substrate; Eia hou, hiki iā mākou ke hāʻawi aku i nā mea kūʻai aku me nā pepa epitaxial silicon carbide homogeneous a heterogeneous; Hiki iā mākou ke hoʻopilikino i ka pepa epitaxial e like me nā pono kikoʻī o nā mea kūʻai aku, a ʻaʻohe palena liʻiliʻi.

NUI HUA HUA NUI

Nui

 6-iniha
Anawaena 150.0mm+0mm/-0.2mm
Kūlana ʻili off-axis: 4° i ka<1120>±0.5°
Ka lōʻihi pālahalaha 47.5mm1.5 mm
Kūlana Pāha mua <1120>±1.0°
Pāpā lua ʻAʻohe
mānoanoa 350.0um±25.0um
Polytype 4H
ʻAno Conductive n-ʻano

NĀ HOʻOPIʻI KIKAIKA

6-iniha
'ikamu Papa P-MOS Papa P-SBD
Kū'ē 0.015Ω·cm-0.025Ω·cm
Polytype ʻAʻole ʻae ʻia
Micropipe Density ≤0.2/cm2 ≤0.5/cm2
EPD ≤4000/cm2 ≤8000/cm2
TED ≤3000/cm2 ≤6000/cm2
BPD ≤1000/cm2 ≤2000/cm2
TSD ≤300/cm2 ≤1000/cm2
SF(Ana ʻia e ka UV-PL-355nm) ≤0.5% wahi ≤1% ʻāpana
Nā papa Hex ma ke kukui ikaika kiʻekiʻe ʻAʻole ʻae ʻia
ʻIke ʻia CarbonInclusions e ke kukui ikaika kiʻekiʻe ʻĀpana hui≤0.05%
微信截图_20240822105943

Kū'ē

Polytype

6 lnch n-type sic substrate (3)
6 lnch n-type sic substrate (4)

BPD&TSD

6 lnch n-type sic substrate (5)
SiC wafers

  • Mua:
  • Aʻe: