ʻO ka ʻenehana Packaging kekahi o nā kaʻina hana nui i ka ʻoihana semiconductor. E like me ke ʻano o ka pōʻai, hiki ke hoʻokaʻawale ʻia i loko o ka puʻupuʻu socket, ka puʻupuʻu mauna o ka honua, ka pūʻulu BGA, ka nui o ka puʻupuʻu chip (CSP), ka pūʻulu module chip hoʻokahi (SCM, ke āpau ma waena o ka uwila ma ka ...
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