Hope Hope o ka Laina (FEOL): Hoʻomoe i ke kahua

ʻO ka mua, waena a me hope o nā laina hana hana semiconductor

Hiki ke hoʻokaʻawale ʻia ke kaʻina hana semiconductor i ʻekolu mau pae:
1) Hope hope o ka laina
2) Ka hopena waena o ka laina
3) Hope hope o ka laina

Hiki iā mākou ke hoʻohana i kahi hoʻohālikelike maʻalahi e like me ke kūkulu ʻana i hale e ʻimi ai i ke kaʻina hana paʻakikī o ka hana ʻana i ka chip:

ʻO ka hope mua o ka laina hana e like me ke kau ʻana i ke kumu a kūkulu i nā paia o kahi hale. I ka hana semiconductor, pili kēia hana i ka hana ʻana i nā hale kumu a me nā transistors ma kahi wafer silika.

Nā ʻanuʻu koʻikoʻi o FEOL:

1. Hoʻomaʻemaʻe: E hoʻomaka me kahi wafer silika lahilahi a hoʻomaʻemaʻe iā ia e wehe i nā haumia.
2.Oxidation: E ulu i kahi papa o ka silicon dioxide ma ka wafer e hoʻokaʻawale i nā ʻāpana like ʻole o ka chip.
3.Photolithography: E hoʻohana i ka photolithography e kaha kiʻi ma luna o ka wafer, e like me ke kaha kiʻi ʻana me ka māmā.
4.Etching: E ​​kiola aku i ka silicon dioxide i makemake ʻole ʻia e hōʻike i nā kumu i makemake ʻia.
5.Doping: E ​​hoʻokomo i nā mea haumia i loko o ke silikona e hoʻololi i kona mau waiwai uila, e hana ana i nā transistors, nā poloka kūkulu kumu o kēlā me kēia chip.

Hoʻopau waena o ka laina (MEOL): Hoʻohui i nā kiko

ʻO ka waena waena o ka laina hana e like me ka hoʻokomo ʻana i nā uwea a me nā paipu i loko o ka hale. Ke nānā nei kēia pae i ka hoʻokumu ʻana i nā pilina ma waena o nā transistors i hana ʻia ma ka pae FEOL.

Nā ʻanuʻu koʻikoʻi o MEOL:

1.Dielectric Deposition: E waiho i nā papa insulating (i kapa ʻia ʻo dielectrics) e pale i nā transistors.
2.Contact Formation: Hoʻopili i nā pilina e hoʻohui i nā transistors i kekahi i kekahi a me ka honua o waho.
3.Interconnect: E hoʻohui i nā ʻāpana metala e hana i nā ala no nā hōʻailona uila, e like me ka uwea ʻana i kahi hale e hōʻoia i ka mana ʻole a me ka kahe ʻikepili.

Hope Hope o ka Laina (BEOL): Hoʻopau ʻana

ʻO ka hope hope o ka laina hana e like me ka hoʻohui ʻana i nā paʻi hope loa i kahi hale - hoʻokomo i nā mea paʻa, pena, a me ka hōʻoia ʻana e hana nā mea āpau. I ka hana semiconductor, pili kēia hana i ka hoʻohui ʻana i nā papa hope a me ka hoʻomākaukau ʻana i ka chip no ka hoʻopili.

Nā ʻanuʻu koʻikoʻi o BEOL:

1.Hoʻohui Metala Layers: E hoʻohui i nā papa metala he nui e hoʻonui i ka pilina, e hōʻoia i ka chip hiki ke mālama i nā hana paʻakikī a me nā wikiwiki kiʻekiʻe.
2.Passivation: E hoʻopili i nā ʻāpana pale e pale i ka chip mai ka pōʻino o ke kaiapuni.
3. Ho'āʻo: E hoʻokō i ka chip i ka hoʻāʻo ikaika e hōʻoia i ka hoʻokō ʻana i nā kikoʻī āpau.
4. Dicing: E ​​ʻoki i ka wafer i loko o nā ʻāpana pākahi, mākaukau kēlā me kēia no ka hoʻopili ʻana a hoʻohana ʻia i nā mea uila.

ʻO Semicera kahi mea hana OEM alakaʻi ma Kina, i hoʻolaʻa ʻia e hāʻawi i ka waiwai kūʻokoʻa i kā mākou mea kūʻai. Hāʻawi mākou i kahi laulā o nā huahana kiʻekiʻe a me nā lawelawe, me:

1.Ka uhi ʻana o CVD SiC(Epitaxy, nā ʻāpana i uhi ʻia i ka CVD maʻamau, nā uhi hana kiʻekiʻe no nā noi semiconductor, a me nā mea hou aku)
2.ʻO nā ʻāpana nui CVD SiC(Na apo etch, apo apo, ʻāpana SiC maʻamau no nā lako semiconductor, a me nā mea hou aku)
3.Nā ʻāpana i uhi ʻia ʻo CVD TaC(Epitaxy, SiC wafer ulu, nā noi wela kiʻekiʻe, a me nā mea hou aku)
4.Māhele Graphite(Nā moku kiʻi, nā ʻāpana graphite maʻamau no ka hana ʻana i ka wela kiʻekiʻe, a me nā mea hou aku)
5.Nā ʻāpana SiC(Nā moku SiC, nā ipu umu ahi SiC, nā ʻāpana SiC maʻamau no ka hoʻoili ʻana i nā mea waiwai, a me nā mea hou aku)
6.Māhele Quartz(Nā moku Quartz, nā ʻāpana quartz maʻamau no nā ʻoihana semiconductor a me nā lā, a me nā mea hou aku)

ʻO kā mākou kūpaʻa i ka maikaʻi e hōʻoia i ka hāʻawi ʻana i nā hopena hou a hilinaʻi hoʻi no nā ʻoihana like ʻole, me ka hana semiconductor, ka hoʻoili ʻana i nā mea hana kiʻekiʻe, a me nā noi ʻenehana kiʻekiʻe. Me ka nānāʻana i ka pololei a me ka maikaʻi, ua hoʻolaʻa mākou i ka hālāwaiʻana i nā pono kūikawā o kēlā me kēia mea kūʻai.