P-type SiC Substrate Wafer

ʻO ka wehewehe pōkole:

Hana ʻia ʻo Semicera's P-type SiC Substrate Wafer no nā noi uila a me ka optoelectronic. Hāʻawi kēia mau wafers i ka conductivity kūikawā a me ke kūpaʻa wela, e hoʻolilo iā lākou i mea kūpono no nā mea hana kiʻekiʻe. Me Semicera, e manaʻo i ka pololei a me ka hilinaʻi i kāu ʻano P-type SiC substrate wafers.


Huahana Huahana

Huahana Huahana

ʻO Semicera's P-type SiC Substrate Wafer kahi mea koʻikoʻi no ka hoʻomohala ʻana i nā polokalamu uila a me nā optoelectronic holomua. Hoʻonohonoho pono ʻia kēia mau wafers e hāʻawi i ka hana i hoʻonui ʻia i nā kaiapuni kiʻekiʻe a me nā wela wela, e kākoʻo ana i ka ulu ʻana o ka noi no nā mea pono a paʻa.

ʻO ka doping P-type i kā mākou mau wafers SiC e hōʻoia i ka hoʻomaikaʻi ʻana i ka conductivity uila a me ka neʻe ʻana o ka mea lawe. ʻO kēia ka mea i kūpono loa ia no nā noi i nā uila uila, nā LED, a me nā pūnaewele photovoltaic, kahi e koʻikoʻi ai ka nalowale o ka mana haʻahaʻa a me ka hana kiʻekiʻe.

Hana ʻia me nā kūlana kiʻekiʻe loa o ka pololei a me ka maikaʻi, ʻo Semicera's P-type SiC wafers e hāʻawi i ka kūlike o ka ʻili a me ka liʻiliʻi liʻiliʻi. He mea koʻikoʻi kēia mau hiʻohiʻona no nā ʻoihana kahi e pono ai ke kūpaʻa a me ka hilinaʻi, e like me ka aerospace, automotive, a me nā ʻāpana ikehu hou.

ʻIke ʻia ko Semicera kūpaʻa i ka hana hou a me ka maikaʻi i kā mākou P-type SiC Substrate Wafer. Ma ka hoʻohui ʻana i kēia mau wafers i kāu kaʻina hana, e hōʻoiaʻiʻo ʻoe e pōmaikaʻi kāu mau hāmeʻa mai nā mea wela a me nā waiwai uila o SiC, e hiki ai iā lākou ke hana pono ma lalo o nā kūlana paʻakikī.

ʻO ka hoʻokomo kālā ʻana i kā Semicera P-type SiC Substrate Wafer, ʻo ia hoʻi ke koho ʻana i kahi huahana e hoʻohui i ka ʻepekema mea ʻokiʻoki me ka ʻenehana loea. Hoʻolaʻa ʻia ʻo Semicera i ke kākoʻo ʻana i ka hanauna hou o nā ʻenehana uila a me optoelectronic, e hāʻawi ana i nā mea pono e pono ai no kou kūleʻa i ka ʻoihana semiconductor.

Nā mea

Paahana

Ka noiʻi

Dummy

Nā Kūlana Crystal

Polytype

4H

Ua hewa ka hoʻonohonoho ʻana o ka ʻili

<11-20 >4±0.15°

Nā Kūlana Uila

Dopant

n-ʻano Nitrogen

Kū'ē

0.015-0.025ohm·cm

Nā Kūlana Mechanical

Anawaena

150.0±0.2mm

mānoanoa

350±25 μm

Kūlana pālahalaha mua

[1-100]±5°

Ka lōʻihi pālahalaha mua

47.5±1.5mm

palahalaha lua

ʻAʻohe

TTV

≤5 μm

≤10 μm

≤15 μm

LTV

≤3 μm(5mm*5mm)

≤5 μm(5mm*5mm)

≤10 μm(5mm*5mm)

Kakaka

-15μm ~ 15μm

-35μm ~ 35μm

-45μm ~ 45μm

Warp

≤35 μm

≤45 μm

≤55 μm

'Oka (AFM) mua (Si-maka)

Ra≤0.2nm (5μm*5μm)

Hoʻolālā

Micropipe mānoanoa

<1 ea/cm2

<10 ea/cm2

<15 ea/cm2

Metala haumia

≤5E10atoms/cm2

NA

BPD

≤1500 ea/cm2

≤3000 ea/cm2

NA

TSD

≤500 ea/cm2

≤1000 ea/cm2

NA

ʻAno o mua

Imua

Si

Hoʻopau ʻili

Si-maka CMP

Nā ʻāpana

≤60ea/wafer (nui≥0.3μm)

NA

Nā ʻōpala

≤5ea/mm. Ka lōʻihi huila ≤Diameter

ʻO ka lōʻihi huila≤2*Diameter

NA

ʻAlani ʻili/mau lua/ʻeleʻele/striations/ māwae/contamination

ʻAʻohe

NA

Nā ʻāpana lihi/indents/fracture/papa hex

ʻAʻohe

Nā wahi polytype

ʻAʻohe

ʻĀpana huila≤20%

ʻĀpana huila≤30%

Hōʻailona laser mua

ʻAʻohe

ʻAno o hope

Hoʻopau hope

C-maka CMP

Nā ʻōpala

≤5ea / mm, Ka lōʻihi huila≤2 * Anawaena

NA

Nā hemahema o hope (nā ʻāpana lihi/indents)

ʻAʻohe

ʻōkalakala kua

Ra≤0.2nm (5μm*5μm)

Hōʻailona laser hope

1 mm (mai ka lihi luna)

Kaulana

Kaulana

Chamfer

Hoʻopili ʻia

Hoʻopili ʻia

Epi-mākaukau me ka hoʻopaʻa ʻumeke

Puke cassette nui-wafer

*Nā memo: "NA" ʻo ia hoʻi, ʻaʻohe noi ʻO nā mea i ʻōlelo ʻole ʻia e pili ana i SEMI-STD.

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SiC wafers

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