Ke manaʻoʻiʻo nei mākou ʻo ka hui lōʻihi ka hopena o ke kūlana kiʻekiʻe, ka waiwai i hoʻohui ʻia, ka ʻike waiwai a me ka pilina pilikino no ke kumukūʻai ʻōlelo no ka High Precision Fully Automatic Wafer Thinning Grinding Polishing and Chamfering Machine, Hoʻomau pinepine mākou i ke kumu o ka "Integrity, Efficiency. , Hana Hou a Win-Win pāʻoihana”. Welina mai e hele i kā mākou pūnaewele a mai kānalua e kamaʻilio me mākou. Ua mākaukau ʻoe? ? ? E hele kāua!!!
Manaʻo mākou ʻo ka pilina lōʻihi ka hopena o ke kūlana kiʻekiʻe, ka lawelawe hoʻohui waiwai, ka ʻike waiwai a me ka pilina pilikino noKina Wafer Chamfering Machine a Wafer, Ua hana mākou ma mua o 10 mau makahiki. Ua hoʻolaʻa mākou i nā huahana maikaʻi a me nā hoʻonā a me ke kākoʻo o nā mea kūʻai. Loaʻa iā mākou i kēia manawa he 27 pono huahana a me nā patent hoʻolālā. Ke kono nei mākou iā ʻoe e kipa i kā mākou hui no kahi huakaʻi pilikino a alakaʻi alakaʻi ʻoihana kiʻekiʻe.
ʻO Zirconia kahi mea me ka ikaika mechanical kiʻekiʻe a me ka paʻakikī haʻihaʻi ma ka lumi wela. Hoʻohui ʻia kā mākou zirconia (ZrO2) me 3mol%Y2O3 ʻāpana zirconia paʻa (PSZ). Ma muli o ka liʻiliʻi o ke anawaena o nā mea PSZ, hiki ke hana ʻia me ka pololei kiʻekiʻe, a ke hoʻonui nei kāna noi ʻana i nā ʻāpana mīkini kikoʻī e like me nā molds. Eia kekahi, hiki ke hoʻohana ʻia no nā mea hana ʻenehana, nā ʻāpana hoʻohui optical a me nā mea hana ʻōpala. Hiki ke hoʻohana ʻia ka paʻakikī haʻihaʻi kiʻekiʻe o PSZ e hana i nā pūnāwai kūikawā, a hoʻohana nui ʻia i nā pahi seramika home, slicer a me nā ʻāpana ʻē aʻe.
Zirconia (ZrO2) Hoʻohana nui wau
ʻO nā mea hoʻoheheʻe a me nā mea hoʻoheheʻe (nā ʻano like ʻole, nā mea hoʻonohonoho pololei, nā mea hoʻokalakupua); Nā ʻāpana wili (classifier, air flow mill, bead mill); ʻO nā mea hana ʻoihana (ka mea ʻoki ʻoihana, ka mīkini slitter, ka paʻi paʻi paʻa); ʻO nā mea hoʻohui Optical (ke apo hoʻopaʻa, lima lima, V-groove fixture); Punawai kūikawā (pūnāwai coil, puna puna); ʻO nā huahana mea kūʻai aku (ka screwdriver insulated liʻiliʻi, ka pahi ceramic, slicer).
Ke manaʻoʻiʻo nei mākou ʻo ka hui lōʻihi ka hopena o ke kūlana kiʻekiʻe, ka waiwai i hoʻohui ʻia, ka ʻike waiwai a me ka pilina pilikino no ke kumukūʻai ʻōlelo no ka High Precision Fully Automatic Wafer Thinning Grinding Polishing and Chamfering Machine, Hoʻomau pinepine mākou i ke kumu o ka "Integrity, Efficiency. , Hana Hou a Win-Win pāʻoihana”. Welina mai e hele i kā mākou pūnaewele a mai kānalua e kamaʻilio me mākou. Ua mākaukau ʻoe? ? ? E hele kāua!!!
Kumukuai i oleloia noKina Wafer Chamfering Machine a Wafer, Ua hana mākou ma mua o 10 mau makahiki. Ua hoʻolaʻa mākou i nā huahana maikaʻi a me nā hoʻonā a me ke kākoʻo o nā mea kūʻai. Loaʻa iā mākou i kēia manawa he 27 pono huahana a me nā patent hoʻolālā. Ke kono nei mākou iā ʻoe e kipa i kā mākou hui no kahi huakaʻi pilikino a alakaʻi alakaʻi ʻoihana kiʻekiʻe.