ʻO Semicera's Silicon On Insulator (SOI) Wafer ka mea mua o ka hana hou semiconductor, e hāʻawi ana i ka hoʻokaʻawale uila i hoʻonui ʻia a me ka hana wela maikaʻi. ʻO ka hoʻolālā SOI, i loaʻa i kahi papa silika lahilahi ma kahi substrate insulating, hāʻawi i nā pono koʻikoʻi no nā mea uila hana kiʻekiʻe.
Hoʻolālā ʻia kā mākou mau wafers SOI e hōʻemi i ka capacitance parasitic a me nā au leakage, he mea nui ia no ka hoʻomohala ʻana i nā kaapuni hoʻohui kiʻekiʻe a me ka mana haʻahaʻa. ʻO kēia ʻenehana holomua e hōʻoia i ka hana ʻoi aku ka maikaʻi o nā hāmeʻa, me ka wikiwiki a me ka hoʻemi ʻana i ka ikehu, koʻikoʻi no nā uila uila hou.
ʻO nā kaʻina hana kiʻekiʻe i hoʻohana ʻia e Semicera e hōʻoiaʻiʻo i ka hana ʻana o nā wafers SOI me ka kūlike a me ka kūlike. He mea koʻikoʻi kēia ʻano no nā noi ma ke kelepona, automotive, a me nā mea hoʻohana uila, kahi e pono ai nā ʻāpana hilinaʻi a kiʻekiʻe.
Ma waho aʻe o kā lākou mau pono uila, hāʻawi ka Semicera's SOI wafers i ka insulation thermal kiʻekiʻe, e hoʻonui ana i ka hoʻoheheʻe wela a me ka paʻa i nā mea kiʻekiʻe a me nā mana kiʻekiʻe. He waiwai nui kēia hiʻohiʻona i nā noi e pili ana i ka hana wela nui a koi i ka hoʻokele wela kūpono.
Ma ke koho ʻana iā Semicera's Silicon On Insulator Wafer, hoʻopukapuka ʻoe i kahi huahana e kākoʻo ana i ka holomua o nā ʻenehana ʻokiʻoki. ʻO kā mākou kūpaʻa i ka maikaʻi a me ka hana hou e hōʻoia i ka hoʻokō ʻana o kā mākou wafer SOI i nā koi koʻikoʻi o ka ʻoihana semiconductor o kēia lā, e hāʻawi ana i ke kumu no nā mea uila e hiki mai ana.
Nā mea | Paahana | Ka noiʻi | Dummy |
Nā Kūlana Crystal | |||
Polytype | 4H | ||
Ua hewa ka hoʻonohonoho ʻana o ka ʻili | <11-20 >4±0.15° | ||
Nā Kūlana Uila | |||
Dopant | n-ʻano Nitrogen | ||
Kū'ē | 0.015-0.025ohm·cm | ||
Nā Kūlana Mechanical | |||
Anawaena | 150.0±0.2mm | ||
mānoanoa | 350±25 μm | ||
Kūlana pālahalaha mua | [1-100]±5° | ||
Ka lōʻihi pālahalaha mua | 47.5±1.5mm | ||
palahalaha lua | ʻAʻohe | ||
TTV | ≤5 μm | ≤10 μm | ≤15 μm |
LTV | ≤3 μm(5mm*5mm) | ≤5 μm(5mm*5mm) | ≤10 μm(5mm*5mm) |
Kakaka | -15μm ~ 15μm | -35μm ~ 35μm | -45μm ~ 45μm |
Warp | ≤35 μm | ≤45 μm | ≤55 μm |
'Oka (AFM) mua (Si-maka) | Ra≤0.2nm (5μm*5μm) | ||
Hoʻolālā | |||
Micropipe mānoanoa | <1 ea/cm2 | <10 ea/cm2 | <15 ea/cm2 |
Metala haumia | ≤5E10atoms/cm2 | NA | |
BPD | ≤1500 ea/cm2 | ≤3000 ea/cm2 | NA |
TSD | ≤500 ea/cm2 | ≤1000 ea/cm2 | NA |
ʻAno o mua | |||
Imua | Si | ||
Hoʻopau ʻili | Si-maka CMP | ||
Nā ʻāpana | ≤60ea/wafer (nui≥0.3μm) | NA | |
Nā ʻōpala | ≤5ea/mm. Ka lōʻihi huila ≤Diameter | ʻO ka lōʻihi huila≤2*Diameter | NA |
ʻAlani ʻili/mau lua/ʻeleʻele/striations/ māwae/contamination | ʻAʻohe | NA | |
Nā ʻāpana lihi/indents/fracture/papa hex | ʻAʻohe | ||
Nā wahi polytype | ʻAʻohe | ʻĀpana huila≤20% | ʻĀpana huila≤30% |
Hōʻailona laser mua | ʻAʻohe | ||
ʻAno o hope | |||
Hoʻopau hope | C-maka CMP | ||
Nā ʻōpala | ≤5ea / mm, Ka lōʻihi huila≤2 * Anawaena | NA | |
Nā pōʻino hope (nā ʻāpana lihi/indents) | ʻAʻohe | ||
ʻōkalakala kua | Ra≤0.2nm (5μm*5μm) | ||
Hōʻailona laser hope | 1 mm (mai ka lihi luna) | ||
Kaulana | |||
Kaulana | Chamfer | ||
Hoʻopili ʻia | |||
Hoʻopili ʻia | Epi-mākaukau me ka hoʻopaʻa ʻumeke Puke cassette nui-wafer | ||
*Nā memo: "NA" ʻo ia hoʻi, ʻaʻohe noi ʻO nā mea i ʻōlelo ʻole ʻia e pili ana i SEMI-STD. |