Na Mea Lawe Wafer

ʻO ka wehewehe pōkole:

Na Mea Lawe Wafer- ʻO nā hoʻonā mālama wafer palekana a maikaʻi e Semicera, i hoʻolālā ʻia e pale a lawe i nā wafer semiconductor me ka pololei loa a me ka hilinaʻi i nā kaiapuni hana kiʻekiʻe.


Huahana Huahana

Huahana Huahana

Hōʻike ʻo Semicera i ka ʻoihana alakaʻiNa Mea Lawe Wafer, hoʻolālā ʻia e hāʻawi i ka pale maikaʻi a me ka lawe ʻole ʻana o nā wafers semiconductor palupalu ma nā ʻano like ʻole o ke kaʻina hana. ʻO kā mākouNa Mea Lawe Waferua hoʻolālā maikaʻi ʻia e hoʻokō i nā koi koʻikoʻi o ka hana semiconductor hou, e hōʻoia i ka mālama pono a me ka maikaʻi o kāu mau wafers i nā manawa āpau.

 

Nā mea nui:

• Kūkulu Mea Pono:Hana ʻia mai nā mea waiwai kiʻekiʻe, kūʻē i ka haumia e hōʻoiaʻiʻo i ka paʻa a me ka lōʻihi o ke ola, e hoʻolilo iā lākou i kūpono no nā wahi lumi maʻemaʻe.

Hoʻolālā pololei:Hōʻike i ka hoʻopololei pololei ʻana o ka slot a me nā mīkini paʻa paʻa e pale i ka paheʻe ʻana o ka wafer a me ka pōʻino i ka wā o ka lawelawe ʻana a me ka lawe ʻana.

Hoʻohālikelike like ʻole:Hoʻokomo i kahi ākea o nā nui wafer a me nā mānoanoa, e hāʻawi ana i ka maʻalahi no nā noi semiconductor like ʻole.

Ergonomic lawelawe:ʻO ka hoʻolālā māmā a me ka mea hoʻohana e hoʻomaʻamaʻa maʻalahi i ka hoʻouka ʻana a me ka wehe ʻana, hoʻonui i ka pono hana a hoʻemi i ka manawa lawelawe.

Nā koho hiki ke hoʻopilikino ʻia:Hāʻawi i ka hana maʻamau e hoʻokō i nā koi kikoʻī, me ke koho ʻana i nā mea waiwai, ka hoʻololi ʻana i ka nui, a me ka lepili no ka hoʻohui ʻana i ka workflow optimized.

 

E hoʻonui i kāu kaʻina hana semiconductor me SemiceraNa Mea Lawe Wafer, ka hoʻonā kūpono no ka mālama ʻana i kāu mau wafers mai ka ʻino a me ka pōʻino mechanical. E hilinaʻi i kā mākou kūpaʻa i ka maikaʻi a me ka hana hou e hoʻopuka i nā huahana ʻaʻole i kū wale akā ma mua o nā kūlana ʻoihana, e hōʻoiaʻiʻo ana i kāu mau hana e holo mālie a maikaʻi.

Nā mea

Paahana

Ka noiʻi

Dummy

Nā Kūlana Crystal

Polytype

4H

Ua hewa ka hoʻonohonoho ʻana o ka ʻili

<11-20 >4±0.15°

Nā Kūlana Uila

Dopant

n-ʻano Nitrogen

Kū'ē

0.015-0.025ohm·cm

Nā Kūlana Mechanical

Anawaena

150.0±0.2mm

mānoanoa

350±25 μm

Kūlana pālahalaha mua

[1-100]±5°

Ka lōʻihi pālahalaha mua

47.5±1.5mm

palahalaha lua

ʻAʻohe

TTV

≤5 μm

≤10 μm

≤15 μm

LTV

≤3 μm(5mm*5mm)

≤5 μm(5mm*5mm)

≤10 μm(5mm*5mm)

Kakaka

-15μm ~ 15μm

-35μm ~ 35μm

-45μm ~ 45μm

Warp

≤35 μm

≤45 μm

≤55 μm

'Oka (AFM) mua (Si-maka)

Ra≤0.2nm (5μm*5μm)

Hoʻolālā

Micropipe mānoanoa

<1 ea/cm2

<10 ea/cm2

<15 ea/cm2

Metala haumia

≤5E10atoms/cm2

NA

BPD

≤1500 ea/cm2

≤3000 ea/cm2

NA

TSD

≤500 ea/cm2

≤1000 ea/cm2

NA

ʻAno o mua

Imua

Si

Hoʻopau ʻili

Si-maka CMP

Nā ʻāpana

≤60ea/wafer (nui≥0.3μm)

NA

Nā ʻōpala

≤5ea/mm. Ka lōʻihi huila ≤Diameter

ʻO ka lōʻihi huila≤2*Diameter

NA

ʻAlani ʻili/mau lua/ʻeleʻele/striations/ māwae/contamination

ʻAʻohe

NA

Nā ʻāpana lihi/indents/fracture/papa hex

ʻAʻohe

Nā wahi polytype

ʻAʻohe

ʻĀpana huila≤20%

ʻĀpana huila≤30%

Hōʻailona laser mua

ʻAʻohe

ʻAno o hope

Hoʻopau hope

C-maka CMP

Nā ʻōpala

≤5ea / mm, Ka lōʻihi huila≤2 * Anawaena

NA

Nā hemahema o hope (nā ʻāpana lihi/indents)

ʻAʻohe

ʻōkalakala kua

Ra≤0.2nm (5μm*5μm)

Hōʻailona laser hope

1 mm (mai ka lihi luna)

Kaulana

Kaulana

Chamfer

Hoʻopili ʻia

Hoʻopili ʻia

Epi-mākaukau me ka hoʻopaʻa ʻumeke

Puke cassette nui-wafer

*Nā memo: "NA" ʻo ia hoʻi, ʻaʻohe noi ʻO nā mea i ʻōlelo ʻole ʻia e pili ana i SEMI-STD.

tech_1_2_size
SiC wafers

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