Hōʻike ʻo Semicera i ka ʻoihana alakaʻiNa Mea Lawe Wafer, hoʻolālā ʻia e hāʻawi i ka pale maikaʻi a me ka lawe ʻole ʻana o nā wafers semiconductor palupalu ma nā ʻano like ʻole o ke kaʻina hana. ʻO kā mākouNa Mea Lawe Waferua hoʻolālā maikaʻi ʻia e hoʻokō i nā koi koʻikoʻi o ka hana semiconductor hou, e hōʻoiaʻiʻo ana i ka mālama pono a me ka maikaʻi o kāu mau wafers i nā manawa āpau.
Nā mea nui:
• Kūkulu Mea Pono:Hana ʻia mai nā mea waiwai kiʻekiʻe, kūʻē i ka haumia e hōʻoiaʻiʻo i ka lōʻihi a me ka lōʻihi, e hoʻolilo iā lākou i mea kūpono no nā lumi lumi maʻemaʻe.
•Hoʻolālā pololei:Hōʻike i ka hoʻopololei pololei ʻana o ka slot a me nā mīkini paʻa paʻa e pale i ka paheʻe ʻana o ka wafer a me ka pōʻino i ka wā o ka lawelawe ʻana a me ka lawe ʻana.
•Hoʻohālikelike like ʻole:Hoʻokomo i kahi ākea o nā nui wafer a me nā mānoanoa, e hāʻawi ana i ka maʻalahi no nā noi semiconductor like ʻole.
•Ergonomic lawelawe:ʻO ka hoʻolālā māmā a me ka mea hoʻohana e hoʻomaʻamaʻa maʻalahi i ka hoʻouka ʻana a me ka wehe ʻana, hoʻonui i ka pono hana a hoʻemi i ka manawa lawelawe.
•Nā koho hiki ke hoʻopilikino ʻia:Hāʻawi i ka hana maʻamau e hoʻokō i nā koi kikoʻī, me ke koho ʻana i nā mea waiwai, ka hoʻololi ʻana i ka nui, a me ka lepili no ka hoʻohui ʻana i ka workflow optimized.
E hoʻonui i kāu kaʻina hana semiconductor me SemiceraNa Mea Lawe Wafer, ka hoʻonā kūpono no ka mālama ʻana i kāu mau wafers mai ka ʻino a me ka pōʻino mechanical. E hilinaʻi i kā mākou kūpaʻa i ka maikaʻi a me ka hana hou e hoʻopuka i nā huahana ʻaʻole i kū wale akā ma mua o nā kūlana ʻoihana, e hōʻoiaʻiʻo ana i kāu mau hana e holo mālie a maikaʻi.
Nā mea | Paahana | Ka noiʻi | Dummy |
Nā Kūlana Crystal | |||
Polytype | 4H | ||
Ua hewa ka hoʻonohonoho ʻana o ka ʻili | <11-20 >4±0.15° | ||
Nā Kūlana Uila | |||
Dopant | n-ʻano Nitrogen | ||
Kū'ē | 0.015-0.025ohm·cm | ||
Nā Kūlana Mechanical | |||
Anawaena | 150.0±0.2mm | ||
mānoanoa | 350±25 μm | ||
Kūlana pālahalaha mua | [1-100]±5° | ||
Ka lōʻihi pālahalaha mua | 47.5±1.5mm | ||
palahalaha lua | ʻAʻohe | ||
TTV | ≤5 μm | ≤10 μm | ≤15 μm |
LTV | ≤3 μm(5mm*5mm) | ≤5 μm(5mm*5mm) | ≤10 μm(5mm*5mm) |
Kakaka | -15μm ~ 15μm | -35μm ~ 35μm | -45μm ~ 45μm |
Warp | ≤35 μm | ≤45 μm | ≤55 μm |
'Oka (AFM) mua (Si-maka) | Ra≤0.2nm (5μm*5μm) | ||
Hoʻolālā | |||
Micropipe mānoanoa | <1 ea/cm2 | <10 ea/cm2 | <15 ea/cm2 |
Metala haumia | ≤5E10atoms/cm2 | NA | |
BPD | ≤1500 ea/cm2 | ≤3000 ea/cm2 | NA |
TSD | ≤500 ea/cm2 | ≤1000 ea/cm2 | NA |
ʻAno o mua | |||
Imua | Si | ||
Hoʻopau ʻili | Si-maka CMP | ||
Nā ʻāpana | ≤60ea/wafer (nui≥0.3μm) | NA | |
Nā ʻōpala | ≤5ea/mm. Ka lōʻihi huila ≤Diameter | ʻO ka lōʻihi huila≤2*Diameter | NA |
ʻAlani ʻili/mau lua/ʻeleʻele/striations/ māwae/contamination | ʻAʻohe | NA | |
Nā ʻāpana lihi/indents/fracture/papa hex | ʻAʻohe | ||
Nā wahi polytype | ʻAʻohe | ʻĀpana huila≤20% | ʻĀpana huila≤30% |
Hōʻailona laser mua | ʻAʻohe | ||
ʻAno o hope | |||
Hoʻopau hope | C-maka CMP | ||
Nā ʻōpala | ≤5ea / mm, Ka lōʻihi huila≤2 * Anawaena | NA | |
Nā pōʻino hope (nā ʻāpana lihi/indents) | ʻAʻohe | ||
ʻōkalakala kua | Ra≤0.2nm (5μm*5μm) | ||
Hōʻailona laser hope | 1 mm (mai ka lihi luna) | ||
Kaulana | |||
Kaulana | Chamfer | ||
Hoʻopili ʻia | |||
Hoʻopili ʻia | Epi-mākaukau me ka hoʻopaʻa ʻumeke Puke cassette nui-wafer | ||
*Nā memo: "NA" ʻo ia hoʻi, ʻaʻohe noi ʻO nā mea i ʻōlelo ʻole ʻia e pili ana i SEMI-STD. |