Hoʻolauna ʻo Semicera i kaWafer Cassette Carrier, he hopena koʻikoʻi no ka mālama pono ʻana i nā wafers semiconductor. Hoʻonohonoho ʻia kēia mea lawe e hoʻokō i nā koi koʻikoʻi o ka ʻoihana semiconductor, e hōʻoiaʻiʻo ana i ka pale a me ka pololei o kāu mau wafers i loko o ke kaʻina hana.
Nā mea nui:
•ʻO ke kūkulu paʻa:ʻO kaWafer Cassette Carrierua kūkulu ʻia mai nā mea kiʻekiʻe a me nā mea paʻa e kū i ka paʻakikī o nā kaiapuni semiconductor, e hāʻawi ana i ka pale hilinaʻi mai ka ʻinoʻino a me ka pōʻino kino.
•Hoʻopololei pololei:Hoʻolālā ʻia no ka hoʻonohonoho pono ʻana i ka wafer, hōʻoia kēia mea lawe i ka paʻa ʻana o nā wafers ma kahi, e hōʻemi ana i ka pilikia o ka misalignment a i ʻole ka pōʻino i ka wā o ka lawe ʻana.
•Hoʻohana maʻalahi:Hoʻolālā ʻia ergonomically no ka maʻalahi o ka hoʻohana ʻana, hoʻomaʻamaʻa ka mea lawe i ka hoʻouka ʻana a me ka wehe ʻana i ke kaʻina hana, hoʻomaikaʻi i ka hana holoʻokoʻa i nā wahi lumi maʻemaʻe.
•Hoʻohālikelike:Hoʻohālikelike ʻia me nā ʻano nui a me nā ʻano wafer, e hoʻolilo iā ia i mea maʻalahi no nā pono hana semiconductor.
E ʻike i ka pale like ʻole a me ka maʻalahi me Semicera'sWafer Cassette Carrier. Hoʻolālā ʻia kā mākou mea lawe e hoʻokō i nā kūlana kiʻekiʻe loa o ka hana semiconductor, e hōʻoiaʻiʻo ana i kāu mau wafers e noho maʻemaʻe mai ka hoʻomaka a hiki i ka pau. E hilinaʻi iā Semicera e hāʻawi i ka maikaʻi a me ka hilinaʻi āu e pono ai no kāu kaʻina hana koʻikoʻi.
Nā mea | Paahana | Ka noiʻi | Dummy |
Nā Kūlana Crystal | |||
Polytype | 4H | ||
Ua hewa ka hoʻonohonoho ʻana o ka ʻili | <11-20 >4±0.15° | ||
Nā Kūlana Uila | |||
Dopant | n-ʻano Nitrogen | ||
Kū'ē | 0.015-0.025ohm·cm | ||
Nā Kūlana Mechanical | |||
Anawaena | 150.0±0.2mm | ||
mānoanoa | 350±25 μm | ||
Kūlana pālahalaha mua | [1-100]±5° | ||
Ka lōʻihi pālahalaha mua | 47.5±1.5mm | ||
palahalaha lua | ʻAʻohe | ||
TTV | ≤5 μm | ≤10 μm | ≤15 μm |
LTV | ≤3 μm(5mm*5mm) | ≤5 μm(5mm*5mm) | ≤10 μm(5mm*5mm) |
Kakaka | -15μm ~ 15μm | -35μm ~ 35μm | -45μm ~ 45μm |
Warp | ≤35 μm | ≤45 μm | ≤55 μm |
'Oka (AFM) mua (Si-maka) | Ra≤0.2nm (5μm*5μm) | ||
Hoʻolālā | |||
Micropipe mānoanoa | <1 ea/cm2 | <10 ea/cm2 | <15 ea/cm2 |
Metala haumia | ≤5E10atoms/cm2 | NA | |
BPD | ≤1500 ea/cm2 | ≤3000 ea/cm2 | NA |
TSD | ≤500 ea/cm2 | ≤1000 ea/cm2 | NA |
ʻAno o mua | |||
Imua | Si | ||
Hoʻopau ʻili | Si-maka CMP | ||
Nā ʻāpana | ≤60ea/wafer (nui≥0.3μm) | NA | |
Nā ʻōpala | ≤5ea/mm. Ka lōʻihi huila ≤Diameter | ʻO ka lōʻihi huila≤2*Diameter | NA |
ʻAlani ʻili/mau lua/ʻeleʻele/striations/ māwae/contamination | ʻAʻohe | NA | |
Nā ʻāpana lihi/indents/fracture/papa hex | ʻAʻohe | ||
Nā wahi polytype | ʻAʻohe | ʻĀpana huila≤20% | ʻĀpana huila≤30% |
Hōʻailona laser mua | ʻAʻohe | ||
ʻAno o hope | |||
Hoʻopau hope | C-maka CMP | ||
Nā ʻōpala | ≤5ea / mm, Ka lōʻihi huila≤2 * Anawaena | NA | |
Nā pōʻino hope (nā ʻāpana lihi/indents) | ʻAʻohe | ||
ʻōkalakala kua | Ra≤0.2nm (5μm*5μm) | ||
Hōʻailona laser hope | 1 mm (mai ka lihi luna) | ||
Kaulana | |||
Kaulana | Chamfer | ||
Hoʻopili ʻia | |||
Hoʻopili ʻia | Epi-mākaukau me ka hoʻopaʻa ʻumeke Puke cassette nui-wafer | ||
*Nā memo: "NA" ʻo ia hoʻi, ʻaʻohe noi ʻO nā mea i ʻōlelo ʻole ʻia e pili ana i SEMI-STD. |