I loko o ke kaulahao ʻoihana semiconductor, ʻoi aku hoʻi i ke kolu o ka hanauna semiconductor (wide bandgap semiconductor) kaulahao ʻoihana, aia nā substrates aepitaxialnā papa. He aha ka mea nui o kaepitaxialpapa? He aha ka ʻokoʻa ma waena o ka substrate a me ka substrate?
ʻO ka substrate he awaferhana ʻia me nā mea aniani semiconductor hoʻokahi. Hiki i ka substrate ke komo pololei i kawaferloulou hana e hana i nā mea semiconductor, a i ʻole hiki ke hana ʻia eepitaxialkaʻina hana e hana i nā wafers epitaxial. ʻO ka substrate ka lalo o kawafer(ʻoki i ka wafer, hiki iā ʻoe ke kiʻi i ka make ma hope o kekahi, a laila e hoʻopaʻa ʻia e lilo i chip kaʻao) (ʻoiaʻiʻo, ua uhi ʻia ka lalo o ka chip me kahi papa gula hope, i hoʻohana ʻia ma ke ʻano he pili "ʻāina", akā, ua hanaʻia ma ke kaʻina hana hope), aʻo ke kumu e lawe i ka hana kākoʻo holoʻokoʻa (ua kūkuluʻia ka skyscraper i loko o ka chip ma luna o ka substrate).
ʻO ka Epitaxy e pili ana i ke kaʻina hana o ka ulu ʻana i kahi aniani hoʻokahi hou ma luna o kahi substrate kristal hoʻokahi i mālama pono ʻia e ka ʻoki ʻana, ka wili, ka polishing, a me nā mea ʻē aʻe. (homoepitaxial a i ʻole heteroepitaxial).
Ma muli o ka ulu ʻana o ka papa aniani hoʻokahi i hana hou ʻia ma ka pae kristal substrate, ua kapa ʻia ʻo ia he papa epitaxial (maʻamau he mau microns mānoanoa. ma luna o kahi pahu aniani silika hoʻokahi me kahi ʻano aniani a me ka resistivity ʻokoʻa a me ka mānoanoa e like me ka substrate), a ua kapa ʻia ka substrate me ka papa epitaxial he wafer epitaxial (epitaxial wafer = epitaxial layer + substrate). Hana ʻia ka hana ʻana i nā mea hana ma ka papa epitaxial.
Hoʻokaʻawale ʻia ka epitaxiality i ka homoepitaxiality a me ka heteroepitaxiality. ʻO ka homoepitaxiality ka ulu ʻana i kahi papa epitaxial o ka mea like me ka substrate ma ka substrate. He aha ke ʻano o ka homoepitaxiality? - Hoʻonui i ka paʻa a me ka hilinaʻi o ka huahana. ʻOiai ʻo ka homoepitaxiality ka ulu ʻana i kahi papa epitaxial o ka mea like me ka substrate, ʻoiai ʻo ka mea like, hiki iā ia ke hoʻomaikaʻi i ka maʻemaʻe a me ka kūlike o ka ʻili wafer. Hoʻohālikelike ʻia me nā wafers i hoʻomaʻemaʻe ʻia e ka mīkini polishing, ʻo ka substrate i hana ʻia e ka epitaxiality he kiʻekiʻe ka palahalaha o ka ʻili, kiʻekiʻe ka maʻemaʻe, ka liʻiliʻi o nā micro defects, a me ka liʻiliʻi o nā haumia ʻili. No laila, ʻoi aku ka like o ka resistivity, a ʻoi aku ka maʻalahi o ka hoʻomalu ʻana i nā hemahema o ka ʻili e like me nā ʻāpana o ka ʻili, ka hoʻopaʻa ʻana i nā hewa, a me nā dislocations. ʻAʻole hoʻomaikaʻi wale ʻo Epitaxy i ka hana huahana, akā hōʻoia pū i ka paʻa a me ka hilinaʻi o ka huahana.
He aha nā pōmaikaʻi o ka hana ʻana i kahi papa ʻē aʻe o nā ʻātoma silika epitaxial ma ka substrate wafer silika? Ma ke kaʻina hana silika CMOS, ʻo ka ulu ʻana o ka epitaxial (EPI, epitaxial) ma ka wafer substrate kahi hana koʻikoʻi loa.
1. Hoʻonui i ka maikaʻi kristal
Nā hemahema o ka substrate mua a me nā haumia: Loaʻa paha i ka substrate wafer kekahi mau hemahema a me nā haumia i ka wā o ka hana ʻana. Hiki i ka ulu ʻana o ka papa epitaxial ke hoʻohua i kahi kiʻekiʻe kiʻekiʻe, haʻahaʻa haʻahaʻa a me ka haumia-concentration one-crystalline silicon layer ma luna o ka substrate, he mea nui loa ia no ka hana ʻana i nā mea hana ma hope. ʻO ke ʻano aniani like ʻole: Hiki i ka ulu ʻana o Epitaxial ke hōʻoia i kahi ʻano aniani like ʻole, e hōʻemi i ka mana o nā palena palaoa a me nā hemahema i ka mea substrate, a pēlā e hoʻomaikaʻi ai i ka maikaʻi kristal o ka wafer holoʻokoʻa.
2. E hoʻomaikaʻi i ka hana uila
E hoʻonui i nā hiʻohiʻona o ka mea hana: Ma ka ulu ʻana i kahi papa epitaxial ma luna o ka substrate, hiki ke hoʻomalu pono ʻia ke ʻano o ka doping a me ke ʻano o ke silika e hoʻokō pono i ka hana uila o ka hāmeʻa. No ka laʻana, hiki i ka doping o ka papa epitaxial ke hoʻoponopono pololei i ka volta paepae a me nā ʻāpana uila ʻē aʻe o ka MOSFET. E hōʻemi i ka leakage i kēia manawa: ʻO nā papa epitaxial kiʻekiʻe he haʻahaʻa haʻahaʻa haʻahaʻa, e kōkua ana i ka hoʻohaʻahaʻa i ka leakage o kēia manawa i ka hāmeʻa, a laila e hoʻomaikaʻi ai i ka hana a me ka hilinaʻi o ka hāmeʻa.
3. Kākoʻo i nā nodes kaʻina holomua
E ho'ēmi ana i ka nui o ka hiʻona: Ma nā node kaʻina hana liʻiliʻi (e like me 7nm, 5nm), hoʻomau ka emi ʻana o ka hiʻona hiʻohiʻona, e koi ana i nā mea i hoʻomaʻemaʻe ʻia a kiʻekiʻe. Hiki i ka ʻenehana ulu epitaxial ke hoʻokō i kēia mau koi a kākoʻo i ka hana kiʻekiʻe a me ke kiʻekiʻe kiʻekiʻe i hoʻohui ʻia. E hoʻomaikaʻi i ka uila haʻihaʻi: Hiki ke hoʻolālā ʻia ka papa epitaxial no ka loaʻa ʻana o ka volta haʻihaʻi kiʻekiʻe, he mea koʻikoʻi no ka hana ʻana i nā mea mana kiʻekiʻe a kiʻekiʻe. No ka laʻana, i loko o nā mana mana, hiki i ka papa epitaxial ke hoʻonui i ka voltage breakdown o ka hāmeʻa a hoʻonui i ka pae hana palekana.
4. Hoʻohālikelike kaʻina hana a me ka hoʻolālā multi-layer
ʻO ke ʻano o nā papa he nui: ʻO ka ʻenehana ulu epitaxial e hiki ke hoʻonui ʻia i nā hale ʻāpana he nui ma luna o kahi substrate, a hiki i nā papa ʻokoʻa ke loaʻa nā ʻano doping ʻokoʻa a me nā ʻano. He mea kōkua nui kēia no ka hana ʻana i nā polokalamu CMOS paʻakikī a loaʻa i ka hoʻohui ʻekolu-dimensional. Hoʻohālikelike: ʻO ke kaʻina hana ulu epitaxial ua kūpono loa me nā kaʻina hana CMOS i loaʻa a hiki ke hoʻohui maʻalahi i nā kaʻina hana i kēia manawa me ka ʻole o ka hoʻololi nui ʻana i nā laina kaʻina.
Ka manawa hoʻouna: Jul-16-2024